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                      Songhan Plastic Technology Co.,Ltd.
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                      Epoxy Technology EPO-TEK? TV1002 Polyimide Adhesive

                      Category Polymer , Adhesive , Thermoset , Polymethacrylimide
                      Manufacturer Epoxy Technology
                      Trade Name EPO-TEK?
                      Port Shanghai port,China
                      Trade Terms FOB, CFR, CIF
                      Payment Terms L/C, T/T, Western Union
                      Download PDF Epoxy Technology EPO-TEK? TV1002 Polyimide Adhesive.pdf
                      Price EMAIL US    sales@www.akotv.net
                        Online Service   lookpolymers   27660005
                      Material Notes:
                      Material Description: A single component, screen printable polyimide adhesive designed for semiconductor wafer passivation applications. It is a high temperature chemistry capable of resisting >400oC seen in back-end wafer fabrication processes. Coating thicknesses of 10-90 um may be achieved. Ultra fine print definition, high Tg, low outgassing, and ionic cleanliness are a few of its traits.Information Provided by Epoxy Technology
                      Physical Properties Metric English Comments
                      Specific Gravity 1.22 g/cc
                      1.22 g/cc
                      Particle Size <= 10 μm
                      <= 10 μm
                      Viscosity 350000 - 550000 cP

                      @Temperature 23.0 °C
                      350000 - 550000 cP

                      @Temperature 73.4 °F
                      0.5 rpm
                      Mechanical Properties Metric English Comments
                      Hardness, Shore D 80
                      Tensile Modulus 7.79 GPa
                      1130 ksi
                      Thermal Properties Metric English Comments
                      CTE, linear 46.0 μm/m-°C
                      25.6 μin/in-°F
                      Below Tg
                      139 μm/m-°C
                      77.2 μin/in-°F
                      Above Tg
                      Thermal Conductivity 0.760 W/m-K
                      5.27 BTU-in/hr-ft2-°F
                      Maximum Service Temperature, Air 300 °C
                      572 °F
                      400 °C
                      752 °F
                      Minimum Service Temperature, Air -55.0 °C
                      -67.0 °F
                      -55.0 °C
                      -67.0 °F
                      Glass Transition Temp, Tg >= 200 °C
                      >= 392 °F
                      Cure 150oC/1 hour + 275oC/1 hours; Ramp 20°C/min to 350oC
                      Decomposition Temperature 519 °C
                      966 °F
                      Degradation Temperature
                      Chemical Properties Metric English Comments
                      Ionic Impurities - Na (Sodium) 107 ppm
                      107 ppm
                      Ionic Impurities - K (Potassium) 2.0 ppm
                      2.0 ppm
                      Ionic Impurities - Cl (Chloride) 50 ppm
                      50 ppm
                      Processing Properties Metric English Comments
                      Cure Time 60.0 min

                      @Temperature 150 °C
                      1.00 hour

                      @Temperature 302 °F
                      + 275°C, Minimum, Pre-Bake
                      Shelf Life 12.0 Month

                      @Temperature 25.0 °C
                      12.0 Month

                      @Temperature 77.0 °F
                      Descriptive Properties Value Comments
                      Color Black
                      Consistency Smooth paste
                      Die Shear 3.8 kg
                      Ionic Impurities NH4 27 ppm
                      Number of Components Single
                      Thixotropic Index >1.3
                      between 0.5 & 1 rpm
                      Weight Loss 0.22%
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